Semiconductor package and method of forming the same

ABSTRACT

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB), a first semiconductor chip mounted on the PCB, and a chip package mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

PRIORITY STATEMENT

This application is a divisional under 35 U.S.C. §121 of U.S. application Ser. No. 12/149,741, filed on May 7, 2008, which claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2007-0044643, filed on May 8, 2007 in the Korean Patent Office (KIPO), the entire contents of each of which are incorporated herein by reference.

BACKGROUND

1. Technical Field

Example embodiments relate to semiconductor devices and methods of forming the same.

2. Description of the Related Art

The packaging of integrated circuits in the semiconductor field is constantly in development as a result of the demand for miniaturization. For example, mounting a plurality of semiconductor chips in a single package so as to achieve a multi-chip package is currently being researched. Among the multi-chip packages, a system-in-package (SIP) has been gaining attention, wherein a SIP is configured to realize a system by sealing a plurality of semiconductor chips, each of the semiconductors having a different function in the single package.

To attain a relatively high-speed operation for a system-in-package (SIP), a non-memory device and a memory device need to be directly connected. However, a direct connection may not be possible if the non-memory device and the memory device have pads in different locations from each other or if the designs of devices have been modified. Therefore, a semiconductor package that allows such an interconnection, regardless of device type or design, would be advantageous.

SUMMARY

Example embodiments relate to semiconductor packages and methods of forming the same. A semiconductor package according to example embodiments may include a printed circuit board (PCB). A first semiconductor chip may be mounted on the PCB. A chip package may be mounted on the first semiconductor chip. The chip package may be in direct contact with the first semiconductor chip.

Another semiconductor package according to example embodiments may include a printed circuit board (PCB); a first semiconductor chip mounted on the PCB; an interposer in direct contact with the first semiconductor chip; a semiconductor chip group mounted on the interposer; an encapsulation layer covering the interposer and the semiconductor chip group; and/or a molding layer covering the encapsulation layer, the first semiconductor chip, and the PCB, wherein the interposer electrically connects the first semiconductor chip to the semiconductor chip group.

A method of forming a semiconductor package according to example embodiments may include mounting a first semiconductor chip on a printed circuit board (PCB). A chip package may be prepared and mounted on the first semiconductor chip. The chip package may be mounted so as to be in direct contact with the first semiconductor chip.

Another method of forming a semiconductor package according to example embodiments may include mounting a first semiconductor chip on a printed circuit board; disposing a first conductive terminal on an upper surface of the first semiconductor chip; preparing a chip package including an interposer, a semiconductor chip group on an upper surface of the interposer, and a second conductive terminal on a lower surface of the interposer; and mounting the chip package on the first semiconductor chip such that the first conductive terminal contacts the second conductive terminal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view of a semiconductor package according to example embodiments.

FIG. 1B is a cross-sectional view of another semiconductor package according to example embodiments.

FIG. 2 and FIGS. 3A to 3D are cross-sectional views of a method of forming a semiconductor package according to example embodiments.

DETAILED DESCRIPTION

It will be understood that when an element or layer is referred to as being “on”, “connected to”, “coupled to”, or “covering” another element or layer, it may be directly on, connected to, coupled to, or covering the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout the specification. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of example embodiments.

Spatially relative terms, e.g., “beneath,” “below,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the term “below” may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

Example embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, example embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an implanted region illustrated as a rectangle will, typically, have rounded or curved features and/or a gradient of implant concentration at its edges rather than a binary change from implanted to non-implanted region. Likewise, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation takes place. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of example embodiments.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, including those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Example embodiments will be described in further detail below with reference to the accompanying drawings. Example embodiments, however, may be embodied in many different forms and should not be construed as limited to the examples set forth herein. In the drawings, the thicknesses of layers and/or regions may have been exaggerated for clarity.

FIG. 1A is a cross-sectional view of a semiconductor package according to example embodiments. Referring to FIG. 1A, the semiconductor package may include a printed circuit board (PCB) 10, a first semiconductor chip 20 and a chip package P1. Lower substrate patterns 14 may be disposed on a lower surface of the PCB 10. Solder balls 16 may be adhered to the lower substrate patterns 14. The solder balls 16 may electrically connect the PCB 10 to an external circuit. Upper substrate patterns 12 may be disposed on an upper surface of the PCB 10.

The first semiconductor chip 20 may be disposed on the PCB 10. An adhesive layer (not shown) may be interposed between the first semiconductor chip 20 and the PCB 10. The first semiconductor chip 20 may be a non-memory device (e.g., logic device). The first semiconductor chip 20 may include first bonding pads 22 disposed near the edge of the upper surface of the first semiconductor chip 20. The first bonding pads 22 may be electrically connected to the upper substrate patterns 12 by first wires 26. First bump pads 24 may be disposed on the upper surface of the first semiconductor chip 20. The first bump pads 24 may be disposed near the center of the upper surface of the first semiconductor chip 20.

The chip package P1 may be directly connected to the first semiconductor chip 20. The chip package P1 may include an interposer I, a semiconductor chip group 120 a, and an encapsulation layer 140. The interposer I may electrically connect the first semiconductor chip 20 and the semiconductor chip group 120 a. The interposer I may include a semiconductor substrate 100 having through-hole vias 110, redistribution patterns 103 connected to the through-hole vias 110, and first bumps 105 connected to the redistribution patterns 103. The redistribution patterns 103 may be disposed on an insulation layer (not shown) on a lower surface of the semiconductor substrate 100. The first bumps 105 may be disposed on the lower surface of the semiconductor substrate 100 so as to be connected to the redistribution patterns 103 and the first bump pads 24 on the first semiconductor chip 20.

The semiconductor chip group 120 a may be disposed on the interposer I. The semiconductor chip group 120 a may include a flip chip 122 a as a second semiconductor chip, a third semiconductor chip 124 a, and a fourth semiconductor chip 126 a. Second bumps 115 may be provided on the lower surface of the flip chip 122 a. The second bumps 115 may be connected to the through-hole vias 110. The flip chip 122 a, the third semiconductor chip 124 a, and the fourth semiconductor chip 126 a may be memory devices. Adhesive layers (not shown) may be interposed between the flip chip 122 a and the third semiconductor chip 124 a and between the third semiconductor chip 124 a and the fourth semiconductor chip 126 a.

The third semiconductor chip 124 a and the fourth semiconductor chip 126 a may be electrically connected to the through-hole vias 110 by second wires 132 and third wires 134, respectively. An encapsulation layer 140 may be provided so as to cover the semiconductor chip group 120 a and the interposer I. The encapsulation layer 140 may include an epoxy molding compound (EMC). A molding layer 150 may be provided so as to cover the encapsulation layer 140, the first semiconductor chip 20, and the PCB 10. The molding layer 150 may be formed of the same material as the encapsulation layer 140. Alternatively, the molding layer 150 may be formed of a different material from the encapsulation layer 140.

According to example embodiments, the chip package P1 may be directly connected to the first semiconductor chip 20. Even when the locations of the bumps and pads of the semiconductor chip group 120 a and the first semiconductor chip 20 have been modified, the semiconductor chip group 120 a and the first semiconductor chip 20 may still be connected to each other by means of the interposer I. Thus, a semiconductor package capable of relatively high-speed operation may be realized, regardless of whether design modifications may be needed in connection with the logic device and/or memory device.

FIG. 1B is a cross-sectional view of another semiconductor package according to example embodiments. It should be understood that the description of common features already discussed above will be omitted for brevity, while any new or different features will be described in further detail below. Referring to FIG. 1B, a semiconductor package according to example embodiments may include a printed circuit board (PCB) 10, a first semiconductor chip 20, and a chip package P2. The PCB 10 may include upper substrate patterns 12, lower substrate patterns 14, and solder balls 16. The first semiconductor chip 20 may include first bonding pads 22 and first bump pads 24 on the upper surface of the first semiconductor chip 20. First wires 26 may be provided to electrically connect the first bonding pads 22 and the upper substrate patterns 12.

The chip package P2 may be directly connected to the first semiconductor chip 20. The chip package P2 may include an interposer I, a semiconductor chip group 120 b, and an encapsulation layer 140. The interposer I may include a semiconductor substrate 100 having through-hole vias 110, redistribution patterns 103 disposed on the lower surface of the semiconductor substrate 100, and first bumps 105 connected to the redistribution patterns 103.

The semiconductor chip group 120 b may include a second semiconductor chip 122 b, a third semiconductor chip 124 b, a fourth semiconductor chip 126 b, and a fifth semiconductor chip 128 b. The second, third, and fourth semiconductor chips 122 b, 124 b, and 126 b, respectively, may be electrically connected to each other by penetration interconnections 125. The penetration interconnections 125 may contact second bumps 115. The fifth semiconductor chip 128 b may include second bonding pads 136 on its upper surface. The second bonding pads 136 may be electrically connected to the through-hole vias 110 by means of second wirings 135.

It should be understood that the chip packages P1 and P2 of FIG. 1 and FIG. 2, respectively, may be embodied in various forms and may include additional semiconductor chips. It should also be understood that the various shapes and forms of the semiconductor chip groups 120 a and 120 b are only examples and should not to be construed to limit example embodiments of the present application.

FIG. 2 and FIGS. 3A to 3D are cross-sectional views of a method of forming a semiconductor package according to example embodiments. Referring to FIG. 2, a first semiconductor chip 20 may be mounted on a printed circuit board (PCB) 10. The PCB 10 may include upper substrate patterns 12 on its upper surface and lower substrate patterns 14 on its lower surface. Solder balls 16 may be bonded to the lower substrate patterns 14 to provide a connection to an external circuit. The first semiconductor chip 20 may include first bonding pads 22 near the edges of its upper surface. First wires 26 may connect the first bonding pads 22 and the upper substrate patterns 12. First bump pads 24 may be formed near the center of the upper surface of the first semiconductor chip 20.

Referring to FIG. 3A, through-hole vias 110 may be formed in a semiconductor substrate 100. Forming the through-hole vias 110 may include creating via holes in the semiconductor substrate 100 with a laser drill and filling the via holes with a conductive metal. The via holes may be filled with a conductive metal using an electroplating method.

Referring to FIG. 3B, first and second semiconductor chip groups 120 a and 120 b may be mounted on the semiconductor substrate 100. The first semiconductor chip group 120 a may include a flip chip 122 a as a second semiconductor chip, a third semiconductor chip 124 a, and a fourth semiconductor chip 126 a. The flip chip 122 a may have second bumps 115 on its lower surface. The second bumps 115 may be connected to the through-hole vias 110. The third semiconductor chip 124 a and the fourth semiconductor chip 126 a may include second bonding pads 131 and third bonding pads 133, respectively. Second wires 132 may connect the second bonding pads 131 and the through-hole vias 110. Third wires 134 may connect the third bonding pads 133 and the through-hole vias 110.

The second semiconductor chip group 120 b may include a second semiconductor chip 122 b, a third semiconductor chip 124 b, a fourth semiconductor chip 126 b, and a fifth semiconductor chip 128 b. The second, third, and fourth semiconductor chips 122 b, 124 b, and 126 b may be electrically connected by penetration interconnections 125. Second bumps 115 may be formed on the lower surface of the second semiconductor chip 122 b so as to contact the penetration interconnections 125. The second bumps 115 may connect the through-hole vias 110 in a flip chip manner. The fifth semiconductor chip 128 b may include second bonding pads 136. Second wirings 135 may electrically connect the second bonding pads 136 and the through-hole vias 110. Although one form of the first and second semiconductor chip groups 120 a and 120 b are discussed above, it should be understood that other variations are also possible.

Referring to FIG. 3C, an encapsulation layer 140 may be formed so as to cover the upper surfaces of the first semiconductor chip group 120 a, the second semiconductor chip group 120 b, and the semiconductor substrate 100. The encapsulation layer 140 may be formed of an epoxy molding compound (EMC). The lower surface of the semiconductor substrate 100 may be etched to reduce the thickness of the semiconductor substrate 100. Etching the lower surface of the semiconductor substrate 100 may include performing a mechanical polishing process followed by a wet etch process. The etching time may be reduced by performing the mechanical polishing process first.

Redistribution patterns 103 may be formed on the lower surface of the semiconductor substrate 100 so as to contact the through-hole vias 110. First bumps 105 may be formed on the lower surface of the semiconductor substrate 100 so as to contact the redistribution patterns 103. Accordingly, an interposer I may include the semiconductor substrate 100, the through-hole vias 110, the redistribution patterns 103, and the first bumps 105.

Referring to FIG. 3D, the semiconductor substrate 100 may be cut to separate the first and second semiconductor chip groups 120 a and 120 b, thus generating a first chip package P1 and a second chip package P2. Before cutting the semiconductor substrate 100, a wafer level test may be performed to identify devices of relatively high quality.

The first chip package P1 may be mounted on a first semiconductor chip 20 (e.g., FIG. 1A). Alternatively, the second chip package P2 may be mounted on a first semiconductor chip 20 (e.g., FIG. 1B). Mounting the first chip package P1 or the second chip package P2 on the first semiconductor chip 20 may include joining the first bumps 105 to the first bump pads 24. A molding layer (not shown) may be formed so as to cover the first chip package P1, the first semiconductor chip 20, and the PCB 10 so as to achieve the semiconductor package of FIG. 1A. Alternatively, a molding layer (not shown) may be formed so as to cover the second chip package P2, the first semiconductor chip 20, and the PCB 10 so as to achieve the semiconductor package of FIG. 1B. The molding layer may be formed of EMC.

According to example embodiments, a chip package may be directly mounted on a semiconductor chip. Even when the locations of the pads and the bumps of a logic device and a memory device are modified, an electrical connection may still be achieved by means of an interposer. Consequently, a semiconductor package capable of relatively high-speed operation may be realized, regardless of whether design modifications may need to be made in connection with a logic device and a memory device.

While example embodiments have been disclosed herein, it should be understood that other variations may be possible. Such variations are not to be regarded as a departure from the spirit and scope of example embodiments of the present application, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims. 

1. A method of forming a semiconductor package, comprising: mounting a first semiconductor chip on a printed circuit board; disposing a first conductive terminal on an upper surface of the first semiconductor chip; preparing a chip package including an interposer, a semiconductor chip group on an upper surface of the interposer, and a second conductive terminal on a lower surface of the interposer; and mounting the chip package on the first semiconductor chip such that the first conductive terminal contacts the second conductive terminal.
 2. The method of claim 1, wherein preparing the chip package further comprises: mounting a second semiconductor chip on the interposer as a flip chip; and mounting a third semiconductor chip on the second semiconductor chip.
 3. The method of claim 2, wherein the interposer is prepared by: forming through-hole vias in a semiconductor substrate; forming redistribution patterns on a lower surface of the semiconductor substrate, the redistribution patterns being connected to the through-hole vias; and forming the second conductive terminal on the lower surface of the semiconductor substrate, the second conductive terminal including first bumps connected to the redistribution patterns.
 4. The method of claim 3, wherein: the first conductive terminal includes first bump pads on an upper surface of the first semiconductor chip; and mounting the chip package on the first semiconductor chip includes connecting the first bumps to the first bump pads.
 5. The method of claim 3, wherein: the third semiconductor chip includes bonding pads, and preparing the chip package includes electrically connecting the bonding pads and the through-hole vias with bonding wires.
 6. The method of claim 3, wherein: the second semiconductor chip includes second bumps on a lower surface of the second semiconductor chip; and mounting the second semiconductor chip on the interposer includes connecting the second bumps to the through-hole vias.
 7. The method of claim 2, further comprising: forming an encapsulation layer on the third semiconductor chip, the second semiconductor chip, and the interposer.
 8. The method of claim 1, further comprising: forming a molding layer on the chip package, the first semiconductor chip, and the printed circuit board.
 9. The method of claim 1, wherein the chip package includes memory devices, and the first semiconductor chip includes a non-memory device.
 10. The method of claim 1, wherein preparing the chip package includes: stacking a plurality of semiconductor chips; and forming penetration interconnections within the plurality of semiconductor chips, the penetration interconnections extending through and electrically connecting the plurality of semiconductor chips. 